Barrier film substrate, method of making same, and use thereof

ABSTRACT

A barrier film substrate includes a first layer including a polymer and a transition metal having chemical sequestering properties such that, upon exposure of the barrier film substrate to one or more chemical vapors, a reaction occurs between the transition metal and the one or more chemical vapors. A second layer is aligned with the first layer. The second layer includes a polymer having impeding properties such that, upon the exposure of the barrier film substrate to the one or more of the chemical vapors, the second layer substantially blocks passage of the one or more of the chemical vapors through the barrier film substrate. One or more additional layers is aligned with at least one of the first layer or the second layer to provide structural support for the first layer and the second layer.

CROSS REFERENCE TO RELATED PATENT APPLICATION

This application claims priority to U.S. Provisional Patent ApplicationNo. 62/545,416, filed Aug. 14, 2017, entitled “BARRIER FILM SUBSTRATE,METHOD OF MAKING SAME, AND USE THEREOF,” the entire contents of which isincorporated herein by reference.

BACKGROUND

Volatile organic compounds (VOCs) are organic chemicals that have a highvapor pressure at ordinary room temperature. The amount of VOCs detectedin a building structure are generally higher than in the outdoorenvironment. While a higher concentration of VOCs in a buildingstructure may be caused in part by inadequate ventilation as well asmultiple sources of VOC emission within the building structure, it isalso known that VOCs may be released from soil into a structure via thefoundation. Since some VOCs are known to be hazardous to human health,it is desirable to minimize the amount of VOCs that pass through thefoundation so as to minimize human exposure to the VOCs. It is notedthat the term “VOCs” may include VVOCs (very volatile organic compounds)and SVOCs (semi-volatile organic compounds). Furthermore, water vaporand gases such as methane and radon may also be harmful either to thebuilding structure itself, and/or the occupants therein.

Accordingly, it is desirable to prevent passage of VOCs, gases, andwater vapor into a structure. Indeed, this desire applies to not onlypassage through the foundation of a structure, but through anybelow-grade wall of a building structure. In addition to protectingbuildings, it may be desirable to further minimize the ability of a VOCand/or other gases or moisture to pass beyond contaminated zones of abuilding structure, soil, ground water, or air. As such, barrier filmsheets have been applied over the soil and beneath a concretefoundation, and in other places to minimize the transmission of theabove-mentioned harmful elements. However, current barrier films arelimited in effectiveness.

BRIEF DESCRIPTION OF THE DRAWINGS

The Detailed Description is set forth with reference to the accompanyingfigures. In the figures, the left-most digit(s) of a reference numberidentifies the figure in which the reference number first appears. Theuse of the same reference numbers in different figures indicates similaror identical items. Furthermore, the drawings may be considered asproviding an approximate depiction of the relative sizes of theindividual components within individual figures. However, the drawingsare not to scale, and the relative sizes of the individual components,both within individual figures and between the different figures, mayvary from what is depicted. In particular, some of the figures maydepict components as a certain size or shape, while other figures maydepict the same components on a larger scale or differently shaped forthe sake of clarity.

FIG. 1 illustrates a sectional view of a barrier film according to anembodiment of this application.

FIG. 2A illustrates a method of forming a barrier film according to anembodiment of this application.

FIG. 2B illustrates additional method steps of forming a barrier filmaccording to an embodiment of this application.

DETAILED DESCRIPTION Overview

This disclosure is directed to a vapor intrusion barrier to attenuateand/or slow down the transmission of hazardous substances, pollutants,and/or contaminants, including but not limited to: VOCs, methane, radon,and water vapor. In particular, this disclosure describes a vaporbarrier film substrate that combines an impeding feature with afiltering/sequestering feature. Furthermore, the barrier film substratedescribed herein has widespread applicability ranging from “below-slab”uses to all other phases of site development and clean-up, including foruse in below-grade walls between the outdoors and the indoors. Morespecifically, a non-limiting example of the disclosure herein is abarrier film substrate for use as a barrier installed within or around abuilding envelope, or at development or cleanup sites, to minimizetransmission of chemical vapors including volatile organic compounds(“VOC”), methane, radon, and water. For the purposes of thisapplication, the “building envelope” may include all areas adjacent toand within a perimeter of a building structure.

Generally, vapor barriers simply try to impede intrusion of vaporsand/or moisture. While such an approach may be somewhat effective inmany instances, the instant disclosure describes an approach of impedingintrusion of the chemicals and filtering/sequestering of the chemicalsattempting to transfer through the barrier film substrate. That is, alayer of material having impeding properties may be included to bepaired with a layer of material having filtering/sequesteringproperties. Other layers may be included as support for structure or tielayers depending on the binding properties of the one or more differentmaterials used in the variety of layers in the vapor barrier filmsubstrate.

Illustrative Embodiments of a Barrier Film Substrate

In FIG. 1, a perspective sectional view of an embodiment of a barrierfilm substrate 100 is depicted. As indicated above, barrier filmsubstrate 100 may include both of a filtering/sequestering feature andan impeding feature by implementing materials having those properties.For example, in an embodiment, barrier film substrate 100 may include afirst layer 102 including a polymer and a transition metal havingchemical filtering/sequestering properties such that, upon exposure ofbarrier film substrate 100 to one or more of the chemical vapors, areaction may occur between the transition metal behaving as a reactiveagent and the one or more chemical vapors, whereby the one or morechemical vapors is broken down and filtered into chemicalsub-components, also known as breakdown products. A result of thereaction may be that the chemical sub-components are either less easilypassed through the impeding layer (discussed below) and/or broken downinto less toxic/harmful, or even harmless, matter. Moreover, as thetransition metal reacts with various passing chemicals, the density ofthe impeding layer may increase, thereby creating a more tortuous pathas a better barrier to oncoming VOCs, gases, and/or water vapor.

With respect to the transition metal mixed with the polymer of firstlayer 102, while the list of known transition metals is significant,several transition metals are considered unstable with short useful lifeor would not have the reactivity required, and thus may not be suitableat this time to include in first layer 102. However, the following listof transition metals that may be implemented in first layer 102includes, but is not limited to: titanium, chromium, manganese, iron,cobalt, nickel, copper, zinc, zirconium, molybdenum, silver, cadmium,hafnium, tungsten, and palladium. Moreover, in an example using copperas the transition metal mixed with the polymer for first layer 102, apercent amount of copper by mass of first layer 102 may range from about2% to about 28%, or from about 5% to about 23%, or from about 10% toabout 20%, for example. Note, the amount of the transition metal usedmay vary depending on the method of forming first layer 102.

Alternatively, in an embodiment, first layer 102 may be formed as ametalized film. As a metalized film, first layer 102 may be added tobarrier film substrate 100 in one of many ways, including via metalvapor deposition, via a metal film laminate, etc. Example materialsinclude the transition metals, as discussed above. Properties of ametalized film first layer 102 may vary somewhat from those discussedherein with respect to a first layer made of a polymer and a transitionmetal. However, a metalized film first layer 102 still hasfiltering/sequestering properties.

Barrier film substrate 100 also includes a second layer 104 that isaligned with first layer 102. Second layer 104 includes a polymer of achemical composition that provides impeding properties such that, uponthe exposure of barrier film substrate 100 to the one or more of thechemical vapors, second layer 104 substantially impedes passage of theone or more of the chemical vapors through barrier film substrate 100.Though there may be external factors that affect the efficacy of theimpeding feature, when used in the same environmental conditions, theefficacy of a barrier film substrate according to the instant disclosureexceeds by an order of magnitude or greater the efficacy of aconventional polyethylene barrier film substrate For example, dependingon environmental site-specific conditions and the specific chemical inquestion, second layer 104 may impede passage of the one or more of thechemical vapors through barrier film substrate 100 within a range of 50to 1,000 times more effectively than a conventional polyethylene barrierfilm. As such, when barrier film substrate 100 is implemented havingsecond layer 104 above first layer 102 with respect to a surface onwhich barrier film substrate 100 is used, the chemical vapors continueto react with and be filtered by first layer 102 due to second layer 104impeding passage (at least initially) of the one or more chemicalvapors. That is, at least a part of the reaction that occurs between thechemical vapors and first layer 102 may be time-based to the extent thatthe effectiveness of breaking down and filtering/sequestering more ofthe chemical vapors increases along with the amount of time that thechemical vapors are blocked and thus forced in contact with first layer102.

As for the material used in second layer 104, a list of materials havingimpeding properties suitable for impeding the chemical vapors and gasesexpected during use includes, but is not limited to: nylon, polyester,ethylene vinyl alcohol (“EVOH”), etc. Depending on the strength of theimpeding properties of the chosen material, a thickness of second layer104 may vary to achieve effective impeding. Furthermore, depending onthe formation properties of the chosen material and the desiredthickness, second layer 104 may be formed via blowing with first layer102 simultaneously, or cast and then laminated with first layer 102subsequent to being cast, or may be formed by a combination of variousprocedures, (e.g., blown, cast, or profile extruded and then laminated).

In an embodiment, a bonding layer 106 may be used to bond first layer102 to second layer 104. This may occur, for example, where therespective materials of first layer 102 and second layer 104 areotherwise incompatible for bonding to each other, where a manufactureris unable to blow enough of the layers simultaneously, where themanufacturer is unable to blow the film to a sufficient thickness so asto require subsequent bonding, etc. Thus, when barrier film substrate100 is blown, the bonding layer 106 may be a tie layer of a materialthat is suitable for bonding to both first layer 102 and second layer104. Likewise, when barrier film substrate 100 is cast and laminated,the bonding layer 106 may be an adhesive layer of an adhesive materialthat is suitable for bonding to both first layer 102 and second layer104. Whether bonding layer 106 is a tie layer or an adhesive layer, thematerial may include other plastic materials, such as, for example, alow density polyethylene (“LDPE”). As indicated below, a bonding layermay be implemented to assist in bonding any two layers of the barrierfilm substrate that would otherwise be immediately adjacent.

Additionally, in a situation where barrier film substrate 100, includingfirst layer 102 and second layer 104, exhibits undesirable properties,(e.g., curling, delamination, other separation issues, instability,other problematic concerns related to strength or durability, etc.), oneor more additional layers 108 may be formed to or with first layer 102and second layer 104, regardless of whether bonding layer 106 isincluded. Moreover, in a situation where barrier film substrate 100,including first layer 102 and second layer 104, does not exhibitundesirable properties, one or more other layer 108 may still be formedto or with first layer 102 and second layer 104, for example to enhancebarrier film substrate 100 with increased or additional desirableproperties. Thus, in an embodiment, a third layer 108 (108 a), a fourthlayer 108 (108 b), and/or a fifth layer 108 (108 c) may be included.Indeed, a barrier film substrate may include more than five layers. Inan embodiment, additional layers 108 may be added to enhance structuralsupport aspects including structural support during manufacture and/orfor installation and in-service purposes, such as increased physicalstrength to resist punctures and improve tensile strength of barrierfilm substrate 100.

As depicted in FIG. 1, in the event third layer 108 (108 a) is included,and disposed on a side of second layer 104 opposite the side againstwhich first layer 102 is disposed, another bonding layer 110 may beformed with or laminated between second layer 104 and third layer 108(108 a). Bonding layer 110 may be included, for example, when therespective materials of second layer 104 and third layer 108 (108 a) arenot sufficiently compatible for bonding directly to each other. Thus,bonding layer 110 may be a tie layer or an adhesive layer as describedwith respect to bonding layer 106 above.

In the event that fourth layer 108 (108 b) is included, fourth layer 108(108 b) may be disposed adjacent a side of first layer 102 opposite theside against which second layer 104 is disposed. As depicted in FIG. 1,fourth layer 108 (108 b) may be included and formed with or otherwisebonded directly to first layer 102. Similarly, in the event that fifthlayer 108 (108 c) is included, fifth layer 108 (108 c) may be disposedadjacent a side of third layer 108 (108 a) opposite the side againstwhich second layer 104 is disposed. As depicted in FIG. 1, fifth layer108 (108 c) may be included and formed with or otherwise bonded directlyto third layer 108 (108 a).

Material selection for additional layers 108 may include, but is notlimited to: LDPE, linear low density polyethylene (“LLDPE”), and/or highdensity polyethylene (“HDPE”), for example. Inasmuch as HDPE has bettervapor barrier properties than either LDPE or LLDPE, in an embodiment,HDPE may be selected for use as fourth layer 108 (108 b). Thus, fourthlayer 108 (108 b) may be an external layer disposed against the side offirst layer 102, which may be placed against the earth or other surfacewhen in use to act as a first line of defense to minimize chemical vaporand moisture transmission. Regardless, fourth layer 108 (108 b), whenadded, may be formed of materials other than HDPE, such as LLDPE, forexample. Additionally, in an embodiment, third layer 108 (108 a) and/orfifth layer 108 (108 c) may include LDPE, LLDPE, or a blend thereof, forexample. Nevertheless, as with fourth layer 108 (108 b), third layer 108(108 a) and fifth layer 108 (108 c)), when added, may be formed ofmaterials other than LDPE, LLDPE, or a blend thereof, such as HDPE, forexample.

Though not depicted explicitly, in an embodiment, fewer than, oralternatively, more than all of other layers 108 (108 a-c) may beincluded in barrier film substrate 100. When forming barrier filmsubstrate 100, a factor, in addition to others discussed above, that mayinfluence the inclusion or one or more of other layers 108 (108 a-c) maybe an effort to balance the film structure by distributing like mass(densities) on each side of the film's thickness cross section. Thisfactor and others may be further influenced by the manner of formation,including but not limited to, blowing and casting.

In forming barrier film substrate 100, factors involved in the decisionof which method of formation to use may include: the densities andthickness of the respective layers; the bonding properties of therespective layers; and the stability of the film structure duringmanufacture.

With regard to a factor that may affect the method of formation, asindicated above, the following thickness values and density values areapproximate, and are provided by way of example. Further, each layer mayvary in thickness and density according to a variety of circumstances.Accordingly, in an example embodiment: a barrier film substrate 100 mayhave an overall thickness ranging from about 5 mils to about 50 mils, orfrom about 10 mils to about 40 mils, or from about 20 mils to about 30mils; a thickness of a first layer 102 having filtering/sequesteringproperties may range from about 0.1 mil to about 10 mils, or about 1 milto about 7 mils, or about 3 mils to about 5 mils; a thickness of asecond layer 104 having impeding properties may range from about 0.1 milto about 3 mils, or about 0.5 mil to about 2 mils, or about 1 mil toabout 1.5 mils; a thickness of an additional layer 108 (e.g., apolyethylene based layer) may range from about 2 mils to about 15 mils,or about 5 mils to about 12 mils, or about 5 mils to about 7 mils; and athickness of a bonding layer 106 (e.g., a tie-layer) may range fromabout 1 mil to about 4 mils, or about 1.5 mils to about 3.5 mils, orabout 2 mils to about 3 mils. Moreover, in a second layer 104 havingimpeding properties, and including EVOH, the ethylene content may rangefrom about 24 to about 44 Mol %, or about 30% to about 40%, or about 33%to about 36%, for example. Additionally, a density of an additionallayer 108 may range from about 0.911 g/cm³ to about 0.965 g/cm³.

As described thus far, in an embodiment where barrier film substrate 100contains a single filtering/sequestering layer (e.g., first layer 102)and a single impeding layer (e.g., second layer 104), barrier filmsubstrate 100 is asymmetrical in cross-section. However, it iscontemplated that barrier film substrate 100 need not be asymmetrical.That is, in an embodiment, a plurality of layers may be aligned so as toform a substrate having symmetry through a plane of a layer of thesubstrate (not shown). For example, the same series of layers on a firstside of the filtering/sequestering layer or the impeding layer may beadded in reverse on a second side of the filtering/sequestering layer orthe impeding layer (i.e., Layer A, Layer B, Layer C, Layer B, Layer A;where Layer C is the filtering/sequestering layer and Layer B is theimpeding layer, or vice versa). In such an embodiment where the barrierfilm substrate is symmetrical with respect to layering, deciding whichside of the barrier film substrate to place against the surface inimplementation is of no consequence. However, in an asymmetricalembodiment, as shown in FIG. 1, the efficacy of the barrier filmsubstrate 100 may vary depending on which side is facing the source ofcontamination due to chemical and vapor transmission and which sidefaces out in use. In such a situation where the orientation of barrierfilm substrate 100 is consequential, an orientation indication mark 112may be included on one or both sides of barrier film substrate 100(shown on top of barrier film substrate 100 as “UP”). Note, indicationmark 112 is not limited to “UP.” Rather, indication mark 112 may includenumbers, words, sentences, symbols, images, a different shade ofcoloration on a side, etc. Likewise, an indication mark placed on thebottom (not shown) of barrier film substrate 100 may be different or thesame as indication mark 112, including but not limited to, numbers,words, sentences, symbols, images, a different shade of coloration on aside, etc.

As previously mentioned, in a situation where barrier film substrate 100is implemented such that second layer 104 is oriented above first layer102, indicator mark 112 may be disposed on an external surface 114 ofbarrier film substrate 100 above second layer 104 so that a user knowsto implement barrier film substrate 100 with external surface 114 facingout away from the surface of implementation, thereby increasing theefficacy of barrier film substrate 100.

In FIG. 2A, a method 200 is depicted including steps for formation of abarrier film substrate according to an embodiment of the instantdisclosure. While the steps of method 200A are depicted in a flowschematic, the steps may be executed in a different order than what isshown without limitation. In step 202, a first layer may be formed. Thefirst layer may include a polymer and a transition metal having chemicalfiltering/sequestering properties such that, upon exposure of the formedbarrier film substrate to one or more of the chemical vapors, a reactionoccurs between the transition metal and the one or more chemical vapors,whereby the one or more chemical vapors is broken down and filtered intochemical sub-components. In step 204, a second layer may be aligned andformed with the first layer. The second layer may include a polymerhaving impeding properties such that, upon the exposure of the barrierfilm substrate to the one or more of the chemical vapors, the secondlayer substantially blocks passage of the one or more of the chemicalvapors through the barrier film substrate, thereby causing the one ormore of the chemical vapors to further react with and be filtered by thefirst layer. Additionally, method 200A may include a step 206, in whicha third layer including one of low density polyethylene (“LDPE”), linearlow density polyethylene (“LLDPE”), or high density polyethylene(“HDPE”) may be formed. The third layer may provide structural supportfor the first layer and the second layer, and the third layer may bealigned with the first layer and the second layer.

As stated above, the barrier film substrate having thefiltering/sequestering and impeding layers may be formed by one ofseveral processes including, but not limited to: profile extrusion, castlamination, inline lamination, blown film, or cast film.

In FIG. 2B, additional steps of a method 200B may be executed inaddition to steps of method 200A. For example, in an embodiment, step208 may be implemented in which a fourth layer is formed. The fourthlayer may include HDPE as an external surface of the barrier filmsubstrate. In step 210, a first tie layer may be formed against a firstside of the second layer between the first layer and the second layer(formed in steps 202 and 204). Similarly, in step 212, a second tielayer may be formed against a second side of the second layer oppositethe first side of the second layer. Additionally, a step 214 may beexecuted, in which a fifth layer including LLDPE is formed as anexternal surface of the barrier film substrate. As indicated above,additional layers may be added in further steps, or, fewer layers may beincluded, and thus, it is contemplated that not all steps may beexecuted.

Example Clauses

A: A barrier film substrate for use as a barrier installed within oraround a building envelope, or at development or cleanup sites, tominimize transmission of chemical vapors including volatile organiccompounds (“VOC”), methane, radon, and water, the barrier film substratecomprising: a first layer including a polymer and a transition metalhaving chemical sequestering properties such that, upon exposure of thebarrier film substrate to one or more of the chemical vapors, a reactionoccurs between the transition metal and the one or more chemical vaporswhereby the one or more chemical vapors is broken down and filtered intochemical sub-components; a second layer aligned with the first layer,the second layer including a polymer having impeding properties suchthat, upon the exposure of the barrier film substrate to the one or moreof the chemical vapors, the second layer substantially blocks passage ofthe one or more of the chemical vapors through the barrier filmsubstrate, thereby causing the one or more of the chemical vapors tofurther react with and be filtered by the first layer; and one or moreadditional layers aligned with at least one of the first layer or thesecond layer to provide structural support for the first layer and thesecond layer.

B: The barrier film substrate according to paragraph A, wherein thetransition metal includes at least one of copper, zinc, iron, nickel, orsilver.

C: The barrier film substrate according to any of paragraphs A-B,wherein the polymer of the second layer is one of ethylene vinyl alcohol“(EVOH”), nylon, or polyester.

D: The barrier film substrate according to any of paragraphs A-C,wherein the film is formed as a blown film.

E: The barrier film substrate according to any of paragraphs A-D,wherein the one or more additional layers include at least one of: athird layer aligned with the first layer and the second layer, the thirdlayer including a linear low density polyethylene (“LLDPE”), or a fourthlayer aligned with the first layer and the second layer, the fourthlayer including a high density polyethylene (“HDPE”).

F: The barrier film substrate according to any of paragraphs A-E,further comprising a tie layer disposed between the first layer and thesecond layer.

G: The barrier film substrate according to any of paragraphs A-F,further comprising an adhesive layer disposed between the first layerand the second layer.

H: A barrier film substrate for use as a barrier installed within oraround a building envelope, or at development or cleanup sites, thebarrier film substrate comprising: a first layer including a polymer anda transition metal having chemical sequestering properties such that,upon exposure of the barrier film substrate to one or more of thechemical vapors, a reaction occurs between the transition metal and theone or more chemical vapors whereby the one or more chemical vapors isbroken down and filtered into chemical sub-components; a second layeraligned with the first layer, the second layer including ethylene vinylalcohol (“EVOH”), and upon the exposure of the barrier film substrate tothe one or more of the chemical vapors, the second layer substantiallyblocks passage of the one or more of the chemical vapors through thebarrier film substrate, thereby causing the one or more of the chemicalvapors to further react with and be filtered by the first layer; and atie layer disposed between the first layer and the second layer to bindthe polymer and the transition metal with the EVOH.

I: The barrier film substrate according to paragraph H, wherein thetransition metal includes at least one of copper, zinc, iron, nickel, orsilver.

J: The barrier film substrate according to any of paragraphs H-I,wherein an amount of the transition metal included in the polymer of thefirst layer ranges between about 2% to about 28% [of a mass of the firstlayer].

K: The barrier film substrate according to any of paragraphs H-J,further comprising: a third layer aligned with the first layer and thesecond layer, the third layer including a linear low densitypolyethylene (“LLDPE”); and a fourth layer aligned with the first layerand the second layer, the fourth layer including a high densitypolyethylene (“HDPE”).

L: The barrier film substrate according to any of paragraphs H-K,wherein the tie layer is disposed against a first side of the secondlayer, and the tie layer is a first tie layer, wherein the third layeris disposed adjacent a second side of the second layer, and wherein thebarrier film substrate further comprises: a second tie layer disposedbetween the second side of the second layer and the third layer.

M: The barrier film substrate according to any of paragraphs H-L,wherein the tie layer is disposed against a first side of the secondlayer, and the tie layer is a first tie layer, wherein the third layeris disposed against a side of the first layer opposite the first tielayer and the second layer, and wherein the barrier film substratefurther comprises: a fifth layer including low density polyethylene(“LDPE”); and a second tie layer disposed between the second side of thesecond layer and the fifth layer.

N: The barrier film substrate according to any of paragraphs H-M,further comprising at least one of: a first indication mark indicativeof a surface placement side, the indication mark being disposed so as tobe visible from a perspective of looking at a first external surface ofthe barrier film substrate that is closer to the first layer than to thesecond layer, or a second indication mark indicative of a face-outplacement side, the indication mark being disposed so as to be visiblefrom a perspective of looking at a second external surface of thebarrier film substrate that is closer to the second layer than to thefirst layer.

O: A method of forming, via a blowing process or a casting process, abarrier film substrate for use as a barrier installed within or around abuilding envelope, or at development or cleanup sites, that minimizestransmission of chemical vapors including volatile organic compounds(“VOC”), methane, radon, and water vapor, the method comprising acts of:forming a first layer including a polymer and a transition metal havingchemical sequestering properties such that, upon exposure of the barrierfilm substrate to one or more of the chemical vapors, a reaction occursbetween the transition metal and the one or more chemical vapors wherebythe one or more chemical vapors is broken down and filtered intochemical sub-components; forming a second layer aligned with the firstlayer, the second layer including a polymer having impeding propertiessuch that, upon the exposure of the barrier film substrate to the one ormore of the chemical vapors, the second layer substantially blockspassage of the one or more of the chemical vapors through the barrierfilm substrate, thereby causing the one or more of the chemical vaporsto further react with and be filtered by the first layer; and forming athird layer including one of low density polyethylene (“LDPE”), linearlow density polyethylene (“LLDPE”), or high density polyethylene(“HDPE”), to provide structural support for the first layer and thesecond layer, the third layer being aligned with the first layer and thesecond layer.

P: The method according to paragraph 0, wherein the third layer includesLLDPE, and the third layer is formed as a first external surface of thebarrier film substrate, and wherein the method further comprises an actof forming a fourth layer including HDPE as a second external surface ofthe barrier film substrate.

Q: The method according to any of paragraphs O-P, wherein the transitionmetal in the first layer is copper, and the second layer includesethylene vinyl alcohol (“EVOH”) or nylon.

R: The method according to any of paragraphs O-Q, further comprisingacts of: forming a first tie layer against a first side of the secondlayer between the first layer and the second layer, and forming a secondtie layer against a second side of the second layer opposite the firstside of the second layer.

S: The method according to any of paragraphs O-R, wherein the thirdlayer includes one of LLDPE or HDPE, and the third layer is formedagainst the first layer.

CONCLUSION

Although several embodiments have been described in language specific tostructural features and/or methodological acts, it is to be understoodthat the claims are not necessarily limited to the specific features oracts described. Rather, the specific features and acts are disclosed asillustrative forms of implementing the claimed subject matter.

What is claimed is:
 1. A method of using a barrier film substrate, themethod comprising: installing the barrier film substrate within oraround a building envelope, or at development or cleanup sites, tominimize transmission of chemical vapors including volatile organiccompounds (“VOC”), methane, radon, and water, the barrier film substrateincluding: a first layer including a polymer and a transition metalhaving chemical sequestering properties such that, upon exposure of thebarrier film substrate to one or more of the chemical vapors, a reactionoccurs between the transition metal and the one or more chemical vaporswhereby the one or more chemical vapors is broken down and filtered intochemical sub-components; a second layer aligned with the first layer,the second layer including a polymer having impeding properties suchthat, upon the exposure of the barrier film substrate to the one or moreof the chemical vapors, the second layer substantially blocks passage ofthe one or more of the chemical vapors through the barrier filmsubstrate, thereby causing the one or more of the chemical vapors tofurther react with and be filtered by the first layer; and one or moreadditional layers aligned with at least one of the first layer or thesecond layer to provide structural support for the first layer and thesecond layer.
 2. The method according to claim 1, wherein the transitionmetal includes at least one of copper, zinc, iron, nickel, or silver. 3.The method according to claim 1, wherein the polymer of the second layeris one of ethylene vinyl alcohol “(EVOH”), nylon, or polyester.
 4. Themethod according to claim 1, wherein the film is formed as a blown film.5. The method according to claim 1, wherein the one or more additionallayers include at least one of: a third layer aligned with the firstlayer and the second layer, the third layer including a linear lowdensity polyethylene (“LLDPE”), or a fourth layer aligned with the firstlayer and the second layer, the fourth layer including a high densitypolyethylene (“HDPE”).
 6. The method according to claim 1, furthercomprising a tie layer disposed between the first layer and the secondlayer.
 7. The method according to claim 1, further comprising anadhesive layer disposed between the first layer and the second layer.